How do emerging technologies change our materials set? Answers to that question will be explored at the new IPC Electronics Materials Forum, Nov. 5–7, 2019, in Minneapolis, Minnesota. The new technical conference is for engineers and managers who procure materials or want to understand the advancements in materials for the board, assembly, components and protective layers.
The forum will focus on materials for board fabrication, assembly and post-assembly protection, with an emphasis on the emerging technologies that challenge the existing materials set. Developments needed for the future will be addressed, and interactive panels will provide opportunities to discuss solutions.
Online registration is open. People interested in speaking at the forum should contact Brook Sandy-Smith, IPC technical education program manager. IPC is a global trade association serving the printed board and electronics assembly industries, their customers and suppliers.