ITW Dynatec introduces Simplicity hot melt adhesive

Hendersonville, Tenn.-based bonding and sealing developer ITW Dynatec will unveil the latest version of its Dynamelt™ S Series adhesive supply unit (ASU) at Pack Expo 2016.

It also will preview its recently developed Simplicity ASU product line. The compact Simplicity unit features single board control and ease of operation, eliminating the need for extensive or ongoing training to run the hot melt function in a production line.

Pack Expo 2016 will be held at Chicago’s McCormick Place Nov. 6-9.